High purity 99%min Fine silica sand for glass production By Mbali import and export pty,

High purity 99%min Fine silica sand for glass production

FOB Price

Get Latest Price

100 ~ 300 / Ton

30 Ton Minimum Order

Country:

USA

Model No:

SL - 500

FOB Price:

100 ~ 300 / Ton (Negotiable) Get Latest Price

Place of Origin:

USA

Price for Minimum Order:

100 per Ton

Minimum Order Quantity:

30 Ton

Packaging Detail:

(1) 25kg bag / with pallet (2) 50kg bag / with pallet (3) 1250kg bag / with pallet

Delivery Time:

prompt

Supplying Ability:

60000 Ton per Month

Payment Type:

T/T, L/C, PayPal, Other

Product Group :

Product Specification

Brand Name: Silica fine sand
Application: glass
SiO2 Content (%): 99.31
Fe2O3 Content (%): 0.018
Al2O3 Content (%): %): 0.36
MgO Content (%): 0.04
CaO Content (%): 0.02-0.09
P2O5 Content (%): 0.0002%
Purity: 3N

High purity 99%min Fine silica sand for glass production:Fine quartz Silica Sand, High purity 99%min fine silica sand

Product Description

Product Application

Fumed silica is the superfine micro-nano fine chemical product,which is divded into hydrophlic type and hydrophobic type in accordance with their different surface treatments.Its appearance is white powder.Native particle size ranges from 5nm to *0 nm,with significant functions of thixotropy,reinforcing,thickening and filling.Therefore,it is widely usd in the industries of rubber,sealant,plastic,resin,paint,printing ink,papermaking,medicine,cosmetics,food etc.

The production of fused silica involves the electrofusing of high purity crytalline silica

to form a solid mass whose properties are enhanced as a result of the process. Fused silica in comparison to crystalline silica is purer, and has a lower specific gravity and linear coefficient of thermal expansion. Key characteristics of fused silica include high temperature resistivity and low conductivity, making it ideal for insulative applications, and precision casting mould application. Also, the low thermal expansion and shock attributes of fused silica means that its dimensions remain unchanged under extreme temperatures. Epoxy molded compounds (with fused silica as a key constituent) are used as a base and encapsulating material for electronic circuitry. This application makes use of fused silica low electrical conductivity and insulative capacity, chemical inertness and electrical transparency with respect to electromagnetic radiation.

Size (mesh)	*0	*5	*0	*5	*0	*0	*0	**0	**0
(%)	0.*0	0.*0	0.*1	0.*2	2.*7	0.*7	5.5	7.3	1.*8

SiO2	9.6%
Fe2O3	0.**0%
Al2O3	0.**0%
Igloss	<0.*5%

Country:	USA
Model No:	SL - 500
FOB Price:	100 ~ 300 / Ton (Negotiable) Get Latest Price
Place of Origin:	USA
Price for Minimum Order:	100 per Ton
Minimum Order Quantity:	30 Ton
Packaging Detail:	(1) 25kg bag / with pallet (2) 50kg bag / with pallet (3) 1250kg bag / with pallet
Delivery Time:	prompt
Supplying Ability:	60000 Ton per Month
Payment Type:	T/T, L/C, PayPal, Other
Product Group :	-